When a heat sink is in intimate contact with a source of heat, like a CPU, heat is transferred in accordance with Newton's Cooling Law:
$$\frac{\mathrm dQ}{\mathrm dt}=uA(T_\textrm{CPU}-T_\textrm{Sink})$$
Where $u$ is a heat transfer coefficient (CPU to sink) and $A$ is the area of contact between the CPU and the heat sink.
Note that $\frac{\mathrm dQ}{\mathrm dt}$ is the heat carried off from the CPU per unit of time.
Higher values of $T_\textrm{Sink}$, as the basic formula shows, actually decrease $\frac{\mathrm dQ}{\mathrm dt}$, which becomes effectively zero when $T_\textrm{CPU}-T_\textrm{Sink}=0$.
To prevent this from happening, the heat sink itself has to transfer accumulated heat, usually to the surrounding air, in which case another heat transfer equation comes into play:
$$\frac{\mathrm dQ}{\mathrm dt}=hA_\textrm{Sink}(T_\textrm{Sink}-T_\textrm{air})$$
Where $h$ is the convection heat transfer coefficient (sink to air) and $A_\textrm{Sink}$ the sink's surface area exposed to the air. $h$ is very dependent on speed or airflow which explains why forced air circulation (fan assisted ventilation) is often used.
In steady state ($T_\textrm {CPU}\approx \text{Constant}$), we have, with $\dot{Q}_\textrm{CPU}$ power generated by the CPU:
$$\dot{Q}_\textrm{CPU}=(T_\textrm{CPU}-T_\textrm{air})\left[\frac{1}{uA}+\frac{1}{hA_\textrm{sink}}\right]=(T_{CPU}-T_\textrm{air})\frac{1}{K}$$
Or:
$$T_\textrm{CPU}=T_\textrm{air}+K\dot{Q}_\textrm{CPU}$$
With:
$$K=\frac{uhAA_\textrm{Sink}}{hA_\textrm{Sink}+uA}$$
The influence of the various factors on $T_\textrm{CPU}$ can be readily appreciated.
Ingenious ways of increasing both $h$ (apart from forced circulation) and $A_\textrm{sink}$ to lower $T_\textrm{CPU}$ have been used like cooling fins or this design (ST-HT4 CPU Cooler Riser):

The highly heat conductive copper bands mostly release the heat from the U-bends.
lm-sensors
package on Linux. – Peter Cordes Aug 23 '16 at 07:18